Introduction

At IBM, work is more than a job - it's a calling: To build. To design. To code. To consult. To think along with clients and sell. To make markets. To invent. To collaborate. Not just to do something better, but to attempt things you've never thought possible. Are you ready to lead in this new era of technology and solve some of the world's most challenging problems? If so, let's talk.

Your role and responsibilities

This position is for a semiconductor unit process packaging engineer with a focus on processes related to dicing. The processing engineer will collaborate with engineers and scientists on a wide variety of dicing applications such as conventional and laser dicing, coring, beveling, scribing, and will take the lead on operating and maintaining a laboratory with such dicing tools. The candidate will be part of a team encompassing the IBM Microelectronics Research Lab (MRL), Albany Nanotech Lab (ANT), and the Quantum Assemble Lab (QAL). These facilities provide world class 200/300 mm wafer scale fabrication and packaging services to multiple clients including Semiconductor Development, Quantum Computing, Artificial Intelligence, and government programs.

Required technical and professional expertise

Familiarity with semiconductor and packaging dicing processing is essential. Capability of learning new processes and semiconductor packaging tools quickly is also key. Driving improvements with processes and tools through inspection and metrology, with a goal of tighter quality distribution, higher efficiency (throughput improvement) and great yield.

Preferred technical and professional experience

Familiarity with semiconductor and packaging processing related to dicing. Great manual dexterity for manipulating smaller mechanical parts. Good organizational, communication, and presentative skills are imperative.